L9305EP datasheet(93/107 Pages) STMICROELECTRONICS

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Table 43. TQFP48 (7x7x1 mm exp. pad down 5.0x5.0) package mechanical data

Symbol

Dimensions

Note

Min.

Typ.

Max.

0°

3.5°

7°

Ө1

0°

Ө2

10°

12°

14°

Ө3

10°

12°

14°

1.20

0.05

0.15

0.95

1.00

1.05

0.17

0.22

0.27

9, 11

0.17

0.20

0.23

0.09

0.20

0.09

0.16

9.00 BSC

7.00 BSC

2, 5

0.50 BSC

9.00 BSC

7.00 BSC

2, 5

0.45

0.60

0.75

1.00 REF

0.08

0.20

Tolerance of form and position

aaa

0.20

1, 7, 20

bbb

0.20

ccc

0.08

ddd

0.08

Notes:

1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.

2. The top package body size may be smaller than the bottom package size up to 0.15 mm.

3. Datum A-B and D to be determined at datum plane H.

4. To be determined at seating datum plane C.

5. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash or protrusions is “0.25

mm” per side. D1 and E1 are maximum plastic body size dimensions including mold mismatch.

6. Details of pin 1 identifier are optional but must be located within the zone indicated.

7. All dimensions are in millimeters.

L9305

Package information

DS12774 - Rev 10

page 93/107

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