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PACKAGE OUTLINE

6.1

5.9

6.1

5.9

1.0

0.8

0.05

0.00

2X 2.4

.000 PKG

0

1.65

2X 0.35

2X 0.25

0.85

2X 1.45

2X 2.4

0.95

1.4 0.1

1.4 0.1

10X 0.35

0.25

4X 0.45

0.35

9X 0.35

0.25

13X 0.6

0.4

(0.1) TYP

(0.4) TYP

4X (0.3)

VQFN - 1 mm max height

DEK0015A

PLASTIC QUAD FLAT PACK - NO LEAD

4228519/B 04/2022

PIN

NUMBER

LEAD SIZE

LEAD WIDTH LEAD LENGTH

1, 6, 8 & 14

0.35 - 0.45

0.40 - 0.60

2 - 5 & 9 - 12

0.25 - 0.35

0.40 - 0.60

0.08 C

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

PIN 1 INDEX AREA

SEATING PLANE

1

7

8

9

14

15

0.1

C A B

0.05

C

0.1

C A B

0.05

C

A

B

C

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INA790A, INA790B

SBOSAA6B – MAY 2024 – REVISED JULY 2025

Copyright © 2025 Texas Instruments Incorporated

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