5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage (Vs)

6

V

Analog Inputs, VIN+, VIN- (2)

Differential (VIN+) - (VIN-)

–12

12

V

Common-mode

GND – 20

120

V

Analog input (REF)

Analog input (REF)

GND – 0.3

Vs + 0.3

V

Analog input (FB)

Analog input (FB)

GND – 0.3

Vs + 0.3

V

Analog output (OUT)

Analog output (OUT)

GND – 0.3

Vs + 0.3

V

Digital output (ALERT)

Temperature Alert Output

GND – 0.3

Vs + 0.3

V

TA

Operating Temperature

–55

150

°C

TJ

Junction temperature

165

°C

Tstg

Storage temperature

–65

165

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

VIN+ and VIN– are the voltages at the IN+ and IN– pins, respectively.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCM

Common-mode input range

–4

110

V

VS

Operating supply range

2.7

5.5

V

ISENSE

Continuous Current

–50

50

A

VREF

Reference voltage range

0

VS

V

VFB

Feed-back voltage range

0

VS

V

TA

Ambient temperature

–40

125

°C

5.4 Thermal Information

THERMAL METRIC(1)

INA790x

UNIT

DEK (VQFN)

15 PINS

RθJA

Junction-to-ambient thermal resistance

28.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

8.3

°C/W

RθJB

Junction-to-board thermal resistance(2)

30.8

°C/W

ΨJT

Junction-to-top characterization parameter(2)

1.1

°C/W

INA790A, INA790B

SBOSAA6B – MAY 2024 – REVISED JULY 2025

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