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PESDXV4UG Datasheet(PDF) 13 Page - NXP Semiconductors |
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PESDXV4UG Datasheet(HTML) 13 Page - NXP Semiconductors |
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13 / 16 page  PESDXV4UF_G_W_3 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 03 — 28 January 2008 13 of 16 NXP Semiconductors PESDxV4UF/G/W Very low capacitance quadruple ESD protection diode arrays Reflow soldering is the only recommended soldering method. Fig 16. Reflow soldering footprint PESDxV4UW (SOT665) 2.45 2.10 0.30 0.15 (2x) 0.375 (2 ×) 0.45 (2 ×) 0.70 (2 ×) 0.40 (5 ×) 0.55 1.60 1.20 2.20 1.25 1.375 2.00 1.70 1.00 solder lands solder resist placement area occupied area 0.075 Dimensions in mm |
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