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EXAMPLE STENCIL DESIGN

(.305 )

[7.74]

2X (.100 )

[2.54]

3X (.039)

[1]

3X (.110)

[2.8]

(.025 )

[0.64]

3X (.054 )

[1.37]

(.201)

[5.1]

4X (.047)

[1.2]

(.023 )

[0.59]

7X (.046 )

[1.18]

(.025 )

[0.64]

5X

(.050 )

[1.27]

24X (.042 )

[1.07]

24X (.046 )

[1.17]

40X (.039)

[1]

40X (.039 )

[0.98]

(R.002 ) TYP

[0.05]

TO-220 - 4.69 mm max height

NDG0003F

TRANSISTOR OUTLINE

4219861/A 01/2022

NOTES: (continued)

5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

6. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD

61% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE: 5X

PKG

PKG

SYMM

1

2

3