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OPA2375IDDFR Datasheet(PDF) 30 Page - Texas Instruments

Part # OPA2375IDDFR
Description  OPA375, OPA2375, OPA4375 500-μV (Maximum), 10-MHz, Low Broadband Noise, RRO, Operational Amplifier
PDF  67 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

OPA2375IDDFR Datasheet(HTML) 30 Page - Texas Instruments

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zero (like input offset voltage), then the typical value is equal to the mean plus one standard deviation (µ + σ) in
order to most accurately represent the typical value.
You can use this chart to calculate approximate probability of a specification in a unit; for example, for OPA2375,
the typical input voltage offset is 150 µV, so 68.2% of all OPA2375 devices are expected to have an offset from
–150 µV to 150 µV.
Specifications with a value in the minimum or maximum column are assured by TI, and units outside these limits
will be removed from production material. For example, the OPA2375 device has a maximum offset voltage of
0.5 mV at 25°C, and even though this corresponds to 5 σ (≈1 in 1.7 million units), which is extremely unlikely, TI
assures that any unit with a larger offset than 0.5 mV will be removed from production material.
For specifications with no value in the minimum or maximum column, consider selecting a sigma value of
sufficient guardband for your application, and design worst-case conditions using this value. For example, the
6-σ value corresponds to about 1 in 500 million units, which is an extremely unlikely chance, and could be an
option as a wide guardband to design a system around. In this case, the OPA2375 does not have a maximum
or minimum for offset voltage drift, but based on Figure 7-40 and the typical value of 0.16 µV/°C in Section 7.6,
it can be calculated that the 6-σ value for offset voltage drift is about 0.96 µV/°C. When designing for worst-case
system conditions, this value can be used to estimate the worst possible offset across temperature without
having an actual minimum or maximum value.
However, process variation and adjustments over time can shift typical means and standard deviations, and
unless there is a value in the minimum or maximum specification column, TI cannot assure the performance of a
device. This information should be used only to estimate the performance of a device.
8.3.7 Shutdown Function
The OPAx375S devices feature SHDN pins that disable the op amp, placing it into a low-power standby mode.
In this mode, the op amp typically consumes less than 1 µA. The SHDN pins are active-low, meaning that
shutdown mode is enabled when the input to the SHDN pin is a valid logic low.
The SHDN pins are referenced to the negative supply voltage of the op amp. The threshold of the shutdown
feature lies around 800 mV (typical) above the negative rail. Hysteresis has been included in the switching
threshold to ensure smooth switching characteristics. To ensure optimal shutdown behavior, the SHDN pins
should be driven with valid logic signals. A valid logic low is defined as a voltage between V– and V– + 0.2 V. A
valid logic high is defined as a voltage between V– + 1.2 V and V+. The shutdown pin must either be connected
to a valid high or a low voltage or driven, and not left as an open circuit. There is no internal pull-up to enable the
amplifier.
The SHDN pins are high-impedance CMOS inputs. Dual op amp versions are independently controlled, and
quad op amp versions are controlled in pairs with logic inputs. For battery-operated applications, this feature
may be used to greatly reduce the average current and extend battery life. The enable time is 15 µs for full
shutdown of all channels; disable time is 3 µs. When disabled, the output assumes a high-impedance state. This
architecture allows the OPAx375S to be operated as a gated amplifier (or to have the device output multiplexed
onto a common analog output bus). Shutdown time (tOFF) depends on loading conditions and increases as load
resistance increases. To ensure shutdown (disable) within a specific shutdown time, the specified 10-kΩ load to
midsupply (VS / 2) is required. If using the OPAx375S without a load, the resulting turnoff time is significantly
increased.
8.3.8 Packages With an Exposed Thermal Pad
The OPAx375 family is available in packages such as the WSON-8 (DSG) which feature an exposed thermal
pad. Inside the package, the die is attached to this thermal pad using an electrically conductive compound. For
this reason, when using a package with an exposed thermal pad, the thermal pad must either be connected to
V– or left floating. Attaching the thermal pad to a potential other than V– is not allowed, and performance of the
device is not assured when doing so.
8.3.9 Common Mode Voltage Range
The input common-mode voltage range of the OPAx375 family extends to the negative rail and within 2 V of
the top rail for normal operation. However, this device can also operate with full rail-to-rail input 100 mV beyond
OPA375, OPA2375
SBOS886E – NOVEMBER 2017 – REVISED AUGUST 2021
www.ti.com
30
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Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: OPA375 OPA2375



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