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OPA2375IDDFR Datasheet(PDF) 7 Page - Texas Instruments

Part # OPA2375IDDFR
Description  OPA375, OPA2375, OPA4375 500-μV (Maximum), 10-MHz, Low Broadband Noise, RRO, Operational Amplifier
PDF  67 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

OPA2375IDDFR Datasheet(HTML) 7 Page - Texas Instruments

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7 Specifications
7.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
Supply voltage, VS = (V+) – (V–)
0
6
V
Signal input pins
Common-mode voltage (3) (4)
(V–) – 0.5
(V+) + 0.5
V
Differential voltage (3)
VS + 0.2
V
Current (3)
–10
10
mA
Output short-circuit (2)
Continuous
Operating ambient temperature, TA
–55
150
°C
Junction temperature, TJ
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
Operating the device beyond the ratings listed under Absolute Maximum Ratings will cause permanent damage to the device.
These are stress ratings only, based on process and design limitations, and this device has not been designed to function outsdie
the conditions indicated under Recommended Operating Conditions. Exposure to any condition outside Recommended Operating
Conditions for extended periods, including absolute-maximum-rated conditions, may affect device reliability and performance.
(2)
Short-circuit to ground, one amplifier per package.
(3)
Input pins are diode-clamped to the power-supply rails. Input signals that may swing more than 0.5 V beyond the supply rails must be
current limited to 10 mA or less.
(4)
Differential input voltages greater than 0.25 V applied continuously can result in a shift to the input offset voltage above the maximum
specification of this parameter. The magnitude of this effect increases as the ambient operating temperature rises.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
OPA375: Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±3000
V
OPA2375: Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
All Devices: Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±1500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN
MAX
UNIT
VS
Supply voltage, (V+) – (V–) , for OPA2375 and OPA4375
1.7(1)
5.5
V
VS
Supply voltage, (V+) – (V–), for OPA375 only
2.25
5.5
V
VI
Input voltage range
(V–)
(V+) – 1.2
V
TA
Specified temperature
–40
125
°C
(1)
Operation between 1.7 V and 1.8 V is only recommened for TA = 0 - 85℃
7.4 Thermal Information for Single Channel
THERMAL METRIC (1)
OPA375
UNIT
DCK
(SC70)
5 PINS
RθJA
Junction-to-ambient thermal resistance
240.9
℃/W
RθJC(top)
Junction-to-case (top) thermal resistance
151.7
℃/W
RθJB
Junction-to-board thermal resistance
64
℃/W
ψJT
Junction-to-top characterization parameter
34.8
℃/W
ψJB
Junction-to-board characterization parameter
63.3
℃/W
www.ti.com
OPA375, OPA2375
SBOS886E – NOVEMBER 2017 – REVISED AUGUST 2021
Copyright © 2021 Texas Instruments Incorporated
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Product Folder Links: OPA375 OPA2375



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