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SN74LVC1G32

SCES219V – APRIL 1999 – REVISED AUGUST 2015

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Copyright © 1999–2015, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 4

6

Specifications......................................................... 5

6.1

Absolute Maximum Ratings ..................................... 5

6.2

ESD Ratings.............................................................. 5

6.3

Recommended Operating Conditions ...................... 6

6.4

Thermal Information .................................................. 6

6.5

Electrical Characteristics........................................... 7

6.6

Switching Characteristics, CL = 15 pF ...................... 7

6.7

Switching Characteristics, 1.8 V and 2.5V................ 7

6.8

Switching Characteristics, 3.3 V and 5 V.................. 8

6.9

Operating Characteristics.......................................... 8

6.10

Typical Characteristics ............................................ 8

7

Parameter Measurement Information .................. 9

8

Detailed Description ............................................ 11

8.1

Overview ................................................................. 11

8.2

Functional Block Diagram ....................................... 11

8.3

Feature Description................................................. 11

8.4

Device Functional Modes........................................ 11

9

Application and Implementation ........................ 12

9.1

Application Information............................................ 12

9.2

Typical Application ................................................. 12

10

Power Supply Recommendations ..................... 13

11

Layout................................................................... 13

11.1

Layout Guidelines ................................................. 13

11.2

Layout Example .................................................... 13

12

Device and Documentation Support ................. 14

12.1

Community Resources.......................................... 14

12.2

Trademarks ........................................................... 14

12.3

Electrostatic Discharge Caution ............................ 14

12.4

Glossary ................................................................ 14

13

Mechanical, Packaging, and Orderable

Information ........................................................... 14

13.1

Package Option Addendum .................................. 18

4 Revision History

Changes from Revision U (April 2014) to Revision V

Page

•

Added TJ junction temp spec to Abs Max Ratings ................................................................................................................. 5

Changes from Revision T (March 2014) to Revision U

Page

•

Updated Features, Description, and Device Information table............................................................................................... 1

•

Added Pin Functions table. .................................................................................................................................................... 4

•

Added Thermal Information table. ......................................................................................................................................... 6

•

Added Detailed Description section. .................................................................................................................................... 11

•

Added Application and Implementation section. ................................................................................................................. 12

•

Added Layout section. ......................................................................................................................................................... 13

Changes from Revision S (July 2013) to Revision T

Page

•

Updated Features. .................................................................................................................................................................. 1

•

Added Applications. ................................................................................................................................................................ 1

•

Added Device Information table. ............................................................................................................................................ 1

•

Added DPW Package. ........................................................................................................................................................... 4

•

Moved Tstg to Handling Ratings table. .................................................................................................................................... 5

Changes from Revision R (June 2013) to Revision S

Page

•

Added parameter values for –40 to 125°C temperature ratings............................................................................................. 7