SN74LVC1G34DBVT datasheet(18/54 Pages) TI2

18 / 54 page

Changes from Revision M (April 2016) to Revision N (June 2025)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

• Changed Device Information table to Package Information .............................................................................. 1

• Changed Junction-to-ambient thermal resistance value for DBV package from: 229°C/W to: 357.1°C/W ....... 5

• Changed Junction-to-case (top) thermal resistance value for DBV package from: 164°C/W to: 263.7°C/W ....5

• Changed Junction-to-board thermal resistance value for DBV package from: 62°C/W to: 264.4°C/W .............5

• Changed Junction-to-top characterization value for DBV package from: 44°C/W to: 195.6°C/W .....................5

• Changed Junction-to-board characterization value for DBV package from: 62°C/W to: 262.2°C/W .................5

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

SN74LVC1G34

SCES519O – DECEMBER 2003 – REVISED OCTOBER 2025

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SN74LVC1G34DBVT Datasheet(PDF) 18 Page - Texas Instruments