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PACKAGE OUTLINE

C

20X 0.25

0.15

1.14±0.05

20X 0.5

0.3

0.5 MAX

(0.15) TYP

0.05

0.00

16X 0.4

2X

2

2X 1.2

1.9±0.05

A

2.6

2.4

B

3.4

3.2

4X (0.36)

(0.1) TYP

X1QFN - 0.5 mm max height

RWP0020A

PLASTIC QUAD FLATPACK - NO LEAD

4221912/A 03/2015

PIN 1 INDEX AREA

0.08

SEATING PLANE

1

6

11

16

7

10

20

17

(OPTIONAL)

PIN 1 ID

0.1

C A

B

0.05

EXPOSED

THERMAL PAD

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 4.200