THS4522IPW datasheet(7/71 Pages) TI2

7 / 71 page

THS4521, THS4522, THS4524

www.ti.com

SBOS458H – DECEMBER 2008 – REVISED JUNE 2015

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted).

(1)

MIN

MAX

UNIT

Supply voltage, VS– to VS+

5.5

Input/output voltage, VI (VIN±, VOUT±, VOCM pins)

(VS–) – 0.7

(VS+) + 0.7

Differential input voltage, VID

Output current, IO

100

Input current, II (VIN±, VOCM pins)

Continuous power dissipation

See Thermal Information table

Maximum junction temperature, TJ

150

°C

Maximum junction temperature, TJ (continuous operation, long-term reliability)

125

°C

Operating free-air temperature, TA

–40

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±1300

Electrostatic

V(ESD)

Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)

±1000

discharge

Machine model (MM)

±50

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VS+ single-supply voltage

2.7

5.0

5.4

TA Ambient temperature

–40

°C

7.4 Thermal Information

THS4521

THS4522

THS4524

THERMAL METRIC(1)

DGK

DBT

UNIT

8 PINS

16 PINS

38 PINS

RθJA

Junction-to-ambient thermal resistance

127.8

193.8

124.2

106.2

RθJC(top) Junction-to-case (top) thermal resistance

81.8

84.1

62.8

60.9

RθJB

Junction-to-board thermal resistance

68.3

115.3

68.5

65.5

°C/W

ψJT

Junction-to-top characterization parameter

32.2

17.9

15.8

18.5

ψJB

Junction-to-board characterization parameter

67.8

113.6

65.1

RθJC(bot) Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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