COUT

VOUT

VIN

GND PLANE

CIN

Represents via used for

application specific connections

IN

GND

OUT

NC

EN

NC

COUT

VOUT

VIN

GND PLANE

CIN

Represents via used for

application specific connections

IN

GND

EN

NC

OUT

16

TLV702

SLVSAG6D – SEPTEMBER 2010 – REVISED JULY 2019

www.ti.com

Product Folder Links: TLV702

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Copyright © 2010–2019, Texas Instruments Incorporated

Layout Guidelines (continued)

10.1.2 Package Mounting

Solder pad footprint recommendations for the TLV702 are available from the TI website at www.ti.com. The

recommended land pattern for the DBV and DSE packages are shown in Figure 28 and Figure 29, respectively.

10.2 Layout Examples

Figure 28. Layout Example for the DBV Package

Figure 29. Layout Example for the DSE Package