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TLV9062IDRG4 Datasheet(PDF) 29 Page - Texas Instruments |
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TLV9062IDRG4 Datasheet(HTML) 29 Page - Texas Instruments |
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29 / 97 page  Changes from Revision J (September 2019) to Revision K (July 2024) Page • Updated the numbering format for tables, figures, and cross-references throughout the document................. 1 • Updated the Device Information table................................................................................................................ 1 • Added package preview note for TLV9062S (YCK, DSBGA) package in Device Information table ..................1 • Added YCK packages to the Device Comparison table..................................................................................... 3 • Added TLV9062S YCK (DSBGA) pinout drawing to Pin Configuration and Functions section.......................... 4 Changes from Revision I (May 2019) to Revision J (September 2019) Page • Deleted TLV9062IDDFR (SOT-23, 8) package preview notations throughout data sheet................................. 1 • Added industry standard package names to Device Comparison Table ........................................................... 3 • Added note to packages with thermal pads, specifying that the thermal pads need to be connected to V–......4 • Added link to Shutdown Function section in SHDN pin function rows................................................................4 • Added EMI Rejection section to the Feature Description section.....................................................................21 • Changed Shutdown Function section to add more clarification .......................................................................22 Changes from Revision H (April 2019) to Revision I (May 2019) Page • Added DDF (SOT-23) thermal information to replace TBDs............................................................................ 10 Changes from Revision G (December 2018) to Revision H (April 2019) Page • Added (SOT-23, 8) information to Device Information .......................................................................................1 • Added DDF package column to Device Comparison Table .............................................................................. 3 • Added DDF (SOT-23) package, to Pin Functions ..............................................................................................4 • Added DDF (SOT-23) package to Thermal Information .................................................................................. 10 Changes from Revision F (September 2018) to Revision G (December 2018) Page • Changed TLV9064 RUC package name from: (WQFN, 14) to: (X2QFN, 14) in Device Information table.........1 • Added RUC (X2QFN) package, pinout information to Pin Functions: TLV9064 table........................................4 • Added TLV9064 RUC (X2QFN) pinout drawing to Pin Configuration and Functions section.............................4 • Added RUC (X2QFN) to Thermal Information: TLV9064 table.........................................................................11 Changes from Revision E (July 2018) to Revision F (September 2018) Page • Deleted Shutdown part numbers from data sheet header .................................................................................1 • Deleted (X2QFN, 10) package from TLV9062 Device Information table............................................................1 • Added references to shutdown part numbers in Description section ................................................................ 1 • Changed TLV906xS series to TLV906xS family throughout data sheet.............................................................1 • Added Shutdown devices to Device Comparison Table .................................................................................... 3 • Changed pin namings for all pinout drawings to reflect updated nomenclature ................................................4 • Added TLV9061S Thermal Information Table...................................................................................................10 • Added TLV9064S Thermal Information Table................................................................................................... 11 • Deleted Partial Shutdown Amplifier Enable Time.............................................................................................12 • Added clarification on selecting resistors for a current sensing application in the Typical Applications Section .............................................................................................................................................................24 • Changed wording of third bullet in Layout Guidelines...................................................................................... 26 www.ti.com TLV9061, TLV9062, TLV9064 SBOS839M – MARCH 2017 – REVISED DECEMBER 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 29 Product Folder Links: TLV9061 TLV9062 TLV9064 |
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