LTC1164

15

1164fa

J Package

24-Lead CERDIP (Narrow .300 Inch, Hermetic)

(Reference LTC DWG # 05-08-1110)

OBSOLETE PACKAGE

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

Figure 15. LTC1164 9th Order Lowpass Elliptic, Fixed fCUTOFF = 4kHz,

fCLK = 400kHz, –74dB at 5kHz, Passband Noise = 210µVRMS ±5V

LTC1164 • AC08

124

223

322

421

520

619

0.1µF

0.1µF

82.5k

30.1k

71.5k

44.2k

121k

75k

28.7k

301k

28.7k

124k

68.1k

30.9k

124k

31.1k

40.2k

30.9k

24.3k

30.1k

38.3k

57.6k

118k

ALL RESISTORS MF 1%

0.1µF

7

18

817

916

10

15

11

14

12

13

R2

R2

R4

R4

V+

V+

V+

C

RG = 80.6k

C = 0.001µF

V–

VIN

RL

R3

R3

R3

R2

RH

RH

RL

RH

RL

RL

RG

RL

RH

RH

R4

R3

R1

R2

R4

R3

R1

R2

R4

VOUT

fCLK

0.1µF

+

–

LT1006

B

B

A

A

D

D

C

C

LTC1164

V–

Figure 16. LTC1164 9th Order Lowpass

Elliptic, fCUTOFF = 4kHz

LTC1164 • AC07

FREQUENCY (Hz)

1k

–90.00

–70.00

–40.00

10.00

10k

20k

–10.00

–80.00

–60.00

–50.00

–30.00

0.0

–20.00

fCLK = 400kHz

VS = ±7.5V

fC = 4kHz

100:1

–74dB AT 1.25 fCUTOFF

J24 0801

.015 – .060

(0.381 – 1.524)

.125

(3.175)

MIN

.014 – .026

(0.360 – 0.660)

.100

(2.54)

BSC

.200

(5.080)

MAX

.045 – .065

(1.143 – 1.651)

.008 – .018

(0.203 – 0.457)

20

16

15

17

14

13

19

11

3

7

56

10

9

12

1

4

2

8

18

.220 – .310

(5.588 – 7.874)

1.290

(32.77)

MAX

21

22

23

24

.025

(0.635)

RAD TYP

NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE

OR TIN PLATE LEADS

0° – 15°

.300 BSC

(7.62 BSC)

.005

(0.127)

MIN

TYPICAL APPLICATIO S

PACKAGE DESCRIPTIO