 2024-2026 Microchip Technology Inc. and its subsidiaries

DS20005820B-page 15

HV232

Microchip Technology Drawing C04-278 Rev A Sheet 2 of 2

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

1.

2.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

48-Lead Low-profile Plastic Quad Flat Pack Package (R8) -7x7 mm Body [LQFP]

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Supertex Legacy Package

H

L

(L1)

SECTION A-A

Molded Package Thickness

Dimension Limits

Mold Draft Angle Top

Foot Length

Lead Width

Molded Package Length

Molded Package Width

Overall Length

Overall Width

Foot Angle

Footprint

Standoff

Overall Height

Lead Pitch

Number of Leads

0.75

0.60

0.45

L

0.22

7.00 BSC

7.00 BSC

9.00 BSC

9.00 BSC

3.5°

1.00 REF

b

D1

E1

0.17

11°

D

E

L1

0°

13°

0.27

7°

1.40

0.50 BSC

48

NOM

MILLIMETERS

A1

A2

A

e

0.05

1.35

1.40

Units

N

MIN

1.45

0.15

1.60

0.10

1.50

MAX

12°