10.5 Trademarks

MicroSiP™, and MagPack™, and TI E2E™ are trademarks of Texas Instruments.

All trademarks are the property of their respective owners.

10.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

10.7 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

11 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (December 2024) to Revision D (June 2026)

Page

• Added TPSM82810 (4A version) in VCA (QFN, 13) package............................................................................ 1

• Added TPSM82810PVCAR to the Device Comparison Table ...........................................................................3

• Moved RCF equations from paragraph text into Table 8-1 for better readability.............................................. 11

• Updated efficiency graphs for the VCA package by extending the viewable range to 4A................................18

Changes from Revision B (July 2024) to Revision C (December 2024)

Page

• Updated the document title by changing "QFN" to "MicroSiP" .......................................................................... 1

• Updated the device name for the WEBENCH bullet, updated the order of bullets, and added the phrase "no

bond wires" in the EMI context in the Features ................................................................................................. 1

• Updated all broken links in the Applications ......................................................................................................1

• Deleted the Advance Information note from the TPSM82813, VCA (QFN, 13) package................................... 1

• Deleted the Advance Information note from TPSM82813PVCAR......................................................................3

• Added separate VCA and SIL Thermal Information tables into one table and added SIL EVM thermal data....5

• Added transient switch node spec to the Absolute Maximum Ratings table and updated table entries to match

device family members data sheets................................................................................................................... 5

• Added BOM table for VCA MagPack package device as different capacitors were used for parameter

measurements.................................................................................................................................................... 9

• Added VCA MagPack package description to the Overview ...........................................................................10

• Updated block diagram to match TPSM82816 in Functional Block Diagram .................................................. 10

• Updated equation and calculation example in COMP/FSET ........................................................................... 11

• Added paragraph about pin and function compatibility between the different members of the device family in

Application Information .................................................................................................................................... 16

• Updated paragraph about WEBENCH tools to match the latest version issued by Texas Instruments in

Custom Design With WEBENCH® Tools ........................................................................................................ 16

• Added more detail to the feedback divider design procedure in Setting the Output Voltage .......................... 17

• Added SOA curves for the VCA package and the SIL package to the Application Curves .............................18

• Updated SIL package based layout example to the latest EVM version and added descriptive text to both of

the layouts in the Layout Examples .................................................................................................................25

• Updated paragraph about WEBENCH tools to match the latest version issued by Texas Instruments in

Custom Design With WEBENCH® Tools ........................................................................................................ 27

TPSM82810, TPSM82813

SLUSDN6D – SEPTEMBER 2019 – REVISED JUNE 2026

www.ti.com

28

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