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SIM689XM Datasheet(PDF) 24 Page - Sanken electric |
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SIM689XM Datasheet(HTML) 24 Page - Sanken electric |
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24 / 55 page ![]() SIM689xM Series SIM689xM-DSE Rev.3.4 SANKEN ELECTRIC CO., LTD. 24 Mar. 05, 2024 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2021 12.2.6 VBB This is the input pin for the main supply voltage, i.e., the positive DC bus. All of the power MOSFET drains (IGBT collectors) of the high-side are connected to this pin. Voltages between the VBB and COMx pins should be set within the recommended range of the main supply voltage, VDC, given in Section 0. To suppress surge voltages, put a 0.01 μF to 0.1 μF bypass capacitor, CS, near the VBB pin and an electrolytic capacitor, CDC, with a minimal length of PCB traces to the VBB pin. 12.2.7 LS1, LS2, LS3A, and LS3B These are the source (emitter) pins of the low-side power MOSFETs (IGBTs). For current detection, the LS1, LS2, and LS3A (LS3B) pins should be externally connected to shunt resistors, RSx. In actual applications, use either of the LS3A or LS3B pin because they are internally connected. When connecting a shunt resistor, use a resistor with low inductance, and place it as near as possible to the IC with a minimum length of traces to the LSx and COMx pins. Otherwise, malfunction may occur because a longer circuit trace increases its inductance and thus increases its susceptibility to improper operations. In applications where long PCB traces are required, add a fast recovery diode, DRSx, between the LSx and COMx pins in order to prevent the IC from malfunctioning. COM1 VBB LS3A LS2 LS1 COM2 VDC RS1 RS2 RS3 CDC CS 11 1 2 28 16 6 Put a shunt resistor near the IC with a minimum length to the LSx pin . Add a fast recovery diode to a long trace. DRS1 DRS2 DRS3 U1 Figure 12-8. Connections to LSx Pin 12.2.8 OCP The OCP pin serves as the input for the overcurrent protections which monitor the currents going through the output transistors. For more details on the overcurrent protection (OCP), see Section 12.4.3. 12.2.9 FO The FO pin operates as the fault signal output. For more details on this function, see Section 12.4.1. Figure 12-9 illustrates an internal circuit diagram of the FO pin and its peripheral circuit. Because of its open-collector nature, the FO pin should be tied by a pull-up resistor, RFO, to the external power supply. The external power supply voltage (i.e., the FO Pin Pull-up Voltage, VFO) should range from 3.0 V to 5.5 V. When the pull-up resistor, RFO, has a too small resistance, the FO pin voltage at fault signal output becomes high due to the saturation voltage drop of a built-in transistor, QFO. Therefore, it is recommended to use a 3.3 kΩ to 10 kΩ pull-up resistor. To suppress noise, add a filter capacitor, CFO, near the IC with minimizing a trace length between the FO and COMx pins. For avoiding repeated OCP activation, the external microcontroller must shut off any input signals to the IC within an OCP hold time, tP = 5 ms (min.), after the internal transistor (QFO) turn-on. (For more details, see Section 12.4.3) Our recommendation is to use a 0.001 μF to 0.01 μF filter capacitor. 5 V 50 Ω 100 kΩ QFO VFO CFO INT RFO U1 4 6 FO COM2 Figure 12-9. Internal Circuit Diagram of FO Pin and Its Peripheral Circuit 12.2.10 VT This pin outputs temperature sensing voltages. The external microcontroller can monitor the junction temperature of the internal control stage, not of the output transistors, with the VT pin. Section 12.3 explains the configuration of the VT pin and its peripheral circuit and the temperature sensing function. 12.3 Temperature Sensing Function The microcontroller can monitor the junction temperature of the internal control stage, through temperature sensing voltages that the VT pin outputs. The IC must be set to stop its operation as it detects an abnormal heating state with temperature sensing voltages. A typical example is turning off input signals from the microcontroller. Figure 12-11 shows a relation between the VT pin voltage and temperature. Table 12-2 |
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