• Removed Package from Device Features table, package option per device configuration is summarized in the

Device Comparison and Mechanical, Packaging, and Orderable Information sections. ................................. 31

• Updated eye diagrams in the Application Curve section.................................................................................. 36

• Added app note "Maintain Isolation Ratings in Half the Size with DFB and DFP Digital Isolator Packaging" to

Related Documentation section........................................................................................................................40

Changes from Revision * (December 2025) to Revision A (March 2026)

Page

• Updated status of the data sheet to mixed status for both production and advanced information devices, refer

to the Packaging Information table on the Package Option Addendum page in the Mechanical, Packaging,

and Orderables section for Production or Preproduction status for specific device and package. Added small

form factor packages Wide-SSOP (DFP-16) and SSOP (DBQ-16) to document. .............................................1

• Updated the CMTI minimum and typical values, updated part to part skew maximum values and removed

clock jitter throughout the document. .................................................................................................................1

• Deleted planned CSA certification and added planned UL 1577 and CSA CAS Notice No. 5A certification

throughout the document. Removed IEC 60601-1 from planned certifications. ................................................ 1

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

• Updated the part to part skew for 2.5V, 3.3V and 5V VCC maximum values and updated the time interval error

(tie) typical values for all VCCs in the Switching Characteristics sections. ..........................................................6

• Updated the minimum and typical CMTI values for all VCCs and updated the typical values for input

capacitance (CI) for all VCCs in Electrical Characteristics sections. ...................................................................6

• Updated the maximum ICC1 and ICC2 values for all VCCs in the Supply Current sections for 10Mbps, 25Mbps

and 100Mbps. Added typical ICC ICC1 and ICC2 values for all VCCs in the Supply Current sections.................. 6

• Added the Insulation Characteristics Curves section to the document............................................................ 24

• Added the Typical Characteristics section to the document............................................................................. 26

• Added the Application Curve section to the document.....................................................................................36

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

ISO6040, ISO6041, ISO6042

SLLSFV3B – DECEMBER 2025 – REVISED AUGUST 2026

www.ti.com

42

Submit Document Feedback

Copyright © 2026 Texas Instruments Incorporated

Product Folder Links: ISO6040 ISO6041 ISO6042