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LPC1111FDH20/002 Datasheet(PDF) 3 Page - NXP Semiconductors |
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LPC1111FDH20/002 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 127 page  LPC111X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.2 — 26 March 2014 3 of 127 NXP Semiconductors LPC1110/11/12/13/14/15 32-bit ARM Cortex-M0 microcontroller LPC1100L series available as TSSOP28 package, DIP28 package, TSSOP20 package, and SO20 package. Extended temperature ( 40 C to +105 C) for selected parts (see Table 2). 3. Applications 4. Ordering information eMetering Lighting Alarm systems White goods Table 1. Ordering information Type number Package Name Description Version SO20, TSSOP20, TSSOP28, and DIP28 packages LPC1110FD20 SO20 SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 LPC1111FDH20/002 TSSOP20 TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 LPC1112FD20/102 SO20 SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 LPC1112FDH20/102 TSSOP20 TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 LPC1112FDH28/102 TSSOP28 TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm SOT361-1 LPC1114FDH28/102 TSSOP28 TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm SOT361-1 LPC1114FN28/102 DIP28 DIP28: plastic dual in-line package; 28 leads (600 mil) SOT117-1 HVQFN24/33, LQFP48, and TFBGA48 packages LPC1111FHN33/101 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1111FHN33/102 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1111FHN33/201 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1111FHN33/202 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1111FHN33/103 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1111JHN33/103 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1111FHN33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1111JHN33/203 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1112FHN33/101 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a LPC1112FHN33/102 HVQFN33 HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7 7 0.85 mm n/a |
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