LSM2-T/30-D12 Series

DOSA-SMT, 30A POL DC/DC Converters

www.murata-ps.com

MDC_LSM2_T30_D12 Series.B11 Page 3 of 12

RECOMMENDED PAD LAYOUT

GND (-H)

TRIM

SENSE

GND

SEQ

ON/OFF

0.405 (10.29)

0.120 (3.05)

0.089 (2.26)

0.000 (0.00)

0.025 (0.64)

GND (-H)

Optional Additional Ground

Pad Size: 0.095 x 0.082 (2.41 x 2.08)

Not Used

Optional Additional Ground

Pad Size: 0.095 x 0.082 (2.41 x 2.08)

Pad Size: Min. 0.140 x 0.095 (3.56 x 2.08)

Dimensions are in inches (mm)

Additional Ground/Thermal Pads (“R” models)

The LSM2-T/30-D12 is optionally available with two additional ground

pads for increased current handling and better heat transfer. These are

indicated with the “R” designator in the model number, LSM2-T/30-D12

R-C.

MPS recommends that users lay out their PC boards to accept these two

pads for larger current applications. Please note that the Derating curves for

the “R” models accept higher temperature and greater current limits than

units without the additional pads.

To realize the additional current and thermal capacity of “R” models, you

must have a substantial area of several square inches of copper etch flow-

soldered to these pads and sufficient feed-throughs or other means of con-

ducting current. The “R” pads and the standard pads 1 and 2 are in parallel.

If your application uses a standard DOSA pad layout and you cannot con-

nect to these ground pads, order model LSM2-T/30-D12-C without the “R”

designator. Please observe the lower Derating curves for standard, “non-R”

models.