Analog Integrated Circuit Device Data

Freescale Semiconductor

7

33937

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ESD Voltage(6)

Human Body Model - HBM (All pins except for the pins listed below)

Pins: PA_Boot, PA_HS_S, PA_HS_G, PB_Boot, PB_HS_S, PB_HS_G,

PC_Boot, PC_HS_S, PC_HS_G, VPWR

Charge Device Model - CDM

Corner pins

All other pins

±2000

±1000

±750

±300

V

THERMAL RATINGS

Storage Temperature

-55 to +150

°C

Operating Junction Temperature

-40 to +150

°C

Thermal Resistance(7)

Junction-to-Case

3.0

°C/W

Soldering Temperature(8)

Note 9

°C

Notes

6.

7.

Case is considered EP - pin 55 under the body of the device. The actual power dissipation of the device is dependent on the operating

mode, the heat transfer characteristics of the board and layout and the operating voltage. See Figure 24 and Figure 25 for examples of

power dissipation profiles of two common configurations. Operation above the maximum operating junction temperature will result in a

reduction in reliability leading to malfunction or permanent damage to the device.

8.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

9.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

Table 2. Maximum Ratings (continued)

damage to the device.

Ratings

Symbol

Value

Unit