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ADV3202/ADV3203

Rev. 0 | Page 6 of 20

ABSOLUTE MAXIMUM RATINGS

POWER DISSIPATION

Table 5.

Parameter

Rating

Analog Supply Voltage (VPOS − VNEG)

7.5 V

Digital Supply Voltage

(DVCC − DGND)

6 V

Ground Potential Difference

(VNEG − DGND)

+0.5 V to –4 V

Maximum Potential Difference

DVCC − VNEG

9.4 V

Disabled Outputs

ADV3202 (|VOSD − VOUT|)

<3 V

ADV3203 (|VOSD −(VOUT+VREF)/2|)

<3 V

|VCLAMP − VINxx|

6 V

VREF Input Voltage

ADV3202

VPOS – 3.5 V to VNEG + 3.5 V

ADV3203

VPOS – 4 V to VNEG + 4 V

Analog Input Voltage

VNEG to VPOS

Digital Input Voltage

DVCC

Output Voltage

(Disabled Analog Output)

(VPOS − 1 V) to (VNEG + 1 V)

Output Short-Circuit Duration

Momentary

Output Short-Circuit Current

45 mA

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature

(Soldering, 10 sec)

300°C

Junction Temperature

150°C

The ADV3202/ADV3203 are operated with ±2.5 V, +5 V, or

±3.3 V supplies and can drive loads down to 150 Ω, resulting in

a large range of possible power dissipations. For this reason,

extra care must be taken while derating the operating conditions

based on ambient temperature.

Packaged in a 176-lead exposed-pad LQFP, the ADV3202/

ADV3203 junction-to-ambient thermal impedance (θJA) is

16°C/W. For long-term reliability, the maximum allowed

junction temperature of the die should not exceed 150°C.

Temporarily exceeding this limit may cause a shift in parametric

performance due to a change in stresses exerted on the die by

the package. Exceeding a junction temperature of 175°C for an

extended period can result in device failure. Figure 3 shows the

range of allowed internal die power dissipations that meet these

conditions over the −40°C to +85°C ambient temperature range.

When using Figure 3, do not include external load power in the

maximum power calculation, but do include load current

dropped on the die output transistors.

AMBIENT TEMPERATURE (°C)

TJ = 150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Figure 3. Maximum Die Power Dissipation vs. Ambient Temperature

THERMAL RESISTANCE

ESD CAUTION

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 6. Thermal Resistance

Package Type

θJA

Unit

176-Lead LQFP_EP

°C/W

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