TMDS361 datasheet(12/42 Pages) TI

12 / 42 page

TMDS DDC and Local I

2C Pins

ELECTRICAL CHARACTERISTICS

TMDS361

SLLS919 – DECEMBER 2008............................................................................................................................................................................................ www.ti.com

DDC I2C Buffer or Repeater: The TMDS361 provides buffering on the DDC I2C interface for each of the input

ports connected. This feature isolates the capacitance on the source side from the sink side and thus helps in

passing system-level compliance. See the DDC I2C Function Description section for a detailed description on

how the DDC I2C buffer operates. Note that a key requirement on the sink side is that the VIL(Sink) (input to

TMDS361) should be less than 0.4 V. This requirement should be met for the DDC I2C buffer to function

properly. There are three settings of VIL(Sink) and VOL(Sink) that can be chosen based on OVS settings (See Table 8

through Table 11).

Local I2C Interface: The TMDS361 includes a slave I2C interface to control device features like TMDS input port

selection, TMDS output edge-rate control, power management, DDC buffer OVS settings, etc. See Table 8

through Table 11.

The TMDS361 is designed to be controlled via a local I2C interface or GPIO interface, based on the status of the

I2C_SEL pin. The local I2C interface in the TMDS361 is only a slave I2C interface. See the I2C INTERFACE

NOTES section for a detailed description of I2C functionality.

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Low-level input current

VCC = 3.6 V, VI = 0 V

–10

µA

Ilkg(Sink)

Input leakage current

Sink pins

VCC = 3.6 V, VI = 4.95 V

–10

µA

DC bias = 2.5 V, AC = 3.5 Vp-p,

CIO(Sink)

Input/output capacitance

Sink pins

f = 100 kHz

VIH(Sink)

High-level input voltage

Sink pins

2.1

5.5

VIL1(Sink)

Low-level input voltage

Sink pins

OVS 1

–0.2

0.4

VOL1(Sink)

Low-level output voltage

Sink pins

IO = 3 mA, OVS = HIGH

0.6

0.7

VIL2(Sink)

Low-level input voltage

Sink pins

OVS 2

–0.2

0.4

VOL2(Sink)

Low-level output voltage

Sink pins

IO = 3 mA, OVS = LOW

0.5

0.6

VIL3(Sink)

Low-level input voltage

Sink pins

OVS 3

–0.2

0.3

VOL3(Sink)

Low-level output voltage

Sink pins

IO = 3 mA, OVS = high-Z

0.4

0.5

Ilkg(I2C)

Input leakage current

Port[1:3] pins

VCC = 3.6 V, VI = 4.95 V

–10

µA

DC bias = 2.5 V, AC = 3.5 Vp-p,

CIO(I2C)

Input/output capacitance

Port[1:3] pins

f = 100 kHz

VIH(I2C)

High-level input voltage

Port[1:3] pins

2.1

5.5

VIL(I2C)

Low-level input voltage

Port[1:3] pins

–0.2

1.5

VOL(I2C)

Low-level output voltage

Port[1:3] pins

IO = 3 mA

0.2

Submit Documentation Feedback

Product Folder Link(s) :TMDS361

TMDS361 Datasheet(PDF) 12 Page - Texas Instruments

TMDS361 Datasheet(HTML) 12 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42

Datasheet Download

Link URL