MPC8641DEC datasheet(91/140 Pages) FREESCALE

Part #	MPC8641DEC

Description	Integrated Host Processor Hardware Specifications

PDF	140 Pages

Scroll/Zoom	100%

Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

Direct Link	http://www.freescale.com

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MPC8641 and MPC8641D Integrated Host Processor Hardware Specifications, Rev. 1

Freescale Semiconductor

Package

16 Package

This section details package parameters and dimensions.

16.1

Package Parameters for the MPC8641

The package parameters are as provided in the following list. The package type is 33 mm x 33 mm, 1023

pins. There are two package options: high-lead Flip Chip-Ceramic Ball Grid Array (FC-CBGA), and

lead-free (FC-CBGA).

For all package types:

Die size

12.1 mm x 14.7 mm

Package outline

33 mm x 33 mm

Interconnects

1023

Pitch

1 mm

Total Capacitor count

43 caps; 100 nF each

For high-lead FC-CBGA (package option: HCTE1 HX)

Maximum module height

2.97 mm

Minimum module height

2.47 mm

Solder Balls

89.5% Pb 10.5% Sn

Ball diameter (typical2)

0.60 mm

For RoHS lead-free FC-CBGA (package option: HCTE1 VU)

Maximum module height

2.77 mm

Minimum module height

2.27 mm

Solder Balls

95.5% Sn 4.0% Ag 0.5% Cu

Ball diameter (typical2)

0.60 mm

1 High-coefficient of thermal expansion

2 Typical ball diameter is before reflow

MPC8641DEC Datasheet(PDF) 91 Page - Freescale Semiconductor, Inc

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