PEMD2_PIMD2_PUMD2_7

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 07 — 24 September 2008

4 of 16

NXP Semiconductors

PEMD2; PIMD2; PUMD2

NPN/PNP resistor-equipped transistors; R1 = 22 k

Ω, R2 = 22 kΩ

[1]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2]

Reflow soldering is the only recommended soldering method.

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Reflow soldering is the only recommended soldering method.

Per device

total power dissipation

[1]

PEMD2 (SOT666)

[2] -

300

mW

PIMD2 (SOT457)

-

600

mW

PUMD2 (SOT363)

-

300

mW

Table 6.

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

Table 7.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Per transistor

thermal resistance from

junction to ambient

in free air

[1]

PEMD2 (SOT666)

[2] -

-

625

K/W

PIMD2 (SOT457)

-

-

417

K/W

PUMD2 (SOT363)

-

-

625

K/W

Per device

thermal resistance from

junction to ambient

in free air

[1]

PEMD2 (SOT666)

[2] -

-

416

K/W

PIMD2 (SOT457)

-

-

208

K/W

PUMD2 (SOT363)

-

-

416

K/W