1

FEATURES

SUPPORTS DEFENSE, AEROSPACE,

3

2

4

6

1

B

GND

A

DCK PACKAGE

(TOP VIEW)

See mechanical drawings for dimensions.

DIR

5

DESCRIPTION/ORDERING INFORMATION

SN74LVC1T45-EP

SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVER

WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS

• Fully Configurable Dual-Rail Design Allows

• Latch-Up Performance Exceeds 100 mA Per

Each Port to Operate Over the Full 1.65-V to

JESD 78, Class II

5.5-V Power-Supply Range

• ESD Protection Exceeds JESD 22

• V

–

2000-V Human-Body Model (A114-A)

GND, Both Ports Are in the High-Impedance

–

200-V Machine Model (A115-A)

State

–

1000-V Charged-Device Model (C101)

• DIR Input Circuit Referenced to V

CCA

• Low Power Consumption, 4-µA Max I

CC

• ±24-mA Output Drive at 3.3 V

AND MEDICAL APPLICATIONS

• Controlled Baseline

• I

Operation

• One Assembly/Test Site

• One Fabrication Site

• Max Data Rates

• Available in Military (–55°C/125°C)

–

420 Mbps (3.3-V to 5-V Translation)

–

210 Mbps (Translate to 3.3 V)

• Extended Product Life Cycle

–

140 Mbps (Translate to 2.5 V)

• Extended Product-Change Notification

–

75 Mbps (Translate to 1.8 V)

• Product Traceability

(1)

Additional temperature ranges are available – contact factory

This single-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is

translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.

ORDERABLE PART NUMBER

–55°C to 125°C

SOT (SC-70) – DCK

Reel of 3000

SN74LVC1T45MDCKREP

NXG

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

(2)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(3)

The actual top-side marking has one additional character that designates the assembly/test site.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2008, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.