ADP3623/ADP3624/ADP3625/ADP3633/ADP3634/ADP3635

Rev. A | Page 6 of 16

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VDD

−0.3 V to +20 V

OUTA, OUTB

DC

−0.3 V to V

<200 ns

−2 V to V

INA, INA, INB,

−0.3 V to V

INB, and SD

ESD

Human Body Model (HBM)

3.5 kV

Field Induced Charged Device Model

(FICDM)

SOIC_N_EP

1.5 kV

MINI_SO_EP

1.0 kV

θ

SOIC_N_EP1

59°C/W

MINI_SO_EP1

43°C/W

Junction Temperature Range

−40°C to +150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature

Soldering (10 sec)

300°C

Vapor Phase (60 sec)

215°C

Infrared (15 sec)

260°C

appropriate with the exposed pad soldered to the PCB.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION