MPC5123 datasheet(24/86 Pages) FREESCALE

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MPC5121E/MPC5123 Data Sheet, Rev. 4

Electrical and Thermal Characteristics

Freescale Semiconductor

3.1.6

Thermal Characteristics

3.1.6.1

Heat Dissipation

An estimation of the chip-junction temperature, TJ, can be obtained from the following equation:

TJ =TA+(RθJA × PD)

Eqn. 3

Typical

300

D5.5

PHY Power Supplies (USB_VDDA, SATA_VDDA)

Typical

200

D5.6

1 Typical core power is measured at V

DD_CORE =1.4 V, Tj =25

oC.

NOTE

The maximum power depends on the supply voltage, process corner,

junction temperature, and the concrete application and clock

configurations.

The worst case power consumption could reach a maximum of 2000 mW.

Table 10. Thermal Resistance Data

Rating

Board Layers

Sym

Value

Unit

SpecID

Junction to Ambient Natural Convection1,2

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2 Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

Single layer board (1s)

RθJA

°C/W

D6.1

Junction to Ambient Natural Convection1,3

3 Per JEDEC JESD51-6 with the board horizontal.

Four layer board (2s2p)

RθJMA

°C/W

D6.2

Junction to Ambient (@200 ft/min)1,3

Single layer board (1s)

RθJMA

°C/W

D6.3

Junction to Ambient (@200 ft/min)1,3

Four layer board (2s2p)

RθJMA

°C/W

D6.4

Junction to Board4

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

—RθJB

°C/W

D6.5

Junction to Case5

5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

—RθJC

8°C/W

D6.6

Junction to Package Top6

6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Natural Convection

2°C/W

D6.7

Table 9. Power Dissipation (continued)

Core Power Supply (VDD_CORE)

SpecID

Mode

High-Performance

Unit

e300 = 300 MHz, CSB = 200 MHz

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