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IP4366CX8/P Datasheet(PDF) 3 Page - NXP Semiconductors

Part # IP4366CX8/P
Description  Integrated SIM card passive filter array with ESD protection to IEC 61000-4-2 level 4
PDF  14 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

IP4366CX8/P Datasheet(HTML) 3 Page - NXP Semiconductors

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IP4064CX8_IP4364CX8_IP4366CX8_2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 11 February 2010
3 of 14
NXP Semiconductors
IP4064CX8; IP4364CX8; IP4366CX8
Integrated SIM card passive filter array with ESD protection
4.
Functional diagram
5.
Limiting values
[1]
Device is qualified with 1000 pulses of
±15 kV contact discharges each, according to the IEC61000-4-2
model and far exceeds the specified level 4 (8 kV contact discharge).
Fig 2.
Schematic diagram
008aaa210
100
Ω
R1
47
Ω
R2
100
Ω
R3
A3
B3
C3
IEC61000-4-2
level 1
protection pins
IEC61000-4-2
level 4
protection pins
A2
C2
B1
C1
B2
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VI
input voltage
−0.5
+5.5
V
VESD
electrostatic discharge
voltage
pins A2, B1, C1 and C2
to ground
contact discharge
[1]
−15
+15
kV
air discharge
[1]
−15
+15
kV
IEC 61000-4-2 level 4;
pins A2, B1, C1 and C2
to ground
contact discharge
−8
+8
kV
air discharge
−15
+15
kV
IEC 61000-4-2 level 1;
pins A3, B3 and C3 to
ground
contact discharge
−2
+2
kV
air discharge
−2
+2
kV
Pch
channel power dissipation
continuous power;
Tamb = 70 °C
-
60
mW
Ptot
total power dissipation
continuous power;
Tamb = 70 °C
-
180
mW
Tstg
storage temperature
−55
+150
°C
Treflow(peak) peak reflow temperature
10 s maximum
-
260
°C
Tamb
ambient temperature
−35
+85
°C



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