IP4064CX8_IP4364CX8_IP4366CX8_2

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© NXP B.V. 2010. All rights reserved.

Product data sheet

Rev. 02 — 11 February 2010

11 of 14

NXP Semiconductors

IP4064CX8; IP4364CX8; IP4366CX8

Integrated SIM card passive filter array with ESD protection

Device removal can be done when the substrate is heated until it is certain that all solder

joints are molten. The chip can then be carefully removed from the substrate without

damaging the tracks and solder lands on the substrate. Removing the device must be

done using plastic tweezers, because metal tweezers can damage the silicon. The

surface of the substrate should be carefully cleaned and all solder and flux residues

and/or underfill removed. When a new chip is placed on the substrate, use the flux

process instead of solder on the solder lands. Apply flux on the bumps at the chip side as

well as on the solder pads on the substrate. Place and align the new chip while viewing

with a microscope. To reflow the solder, use the solder profile shown in application note

AN10365 “Surface mount reflow soldering description”.

9.3.4 Cleaning

Cleaning can be done after reflow soldering.

10. Abbreviations

11. Revision history

Table 7.

Abbreviations

Acronym

Description

DUT

Device Under Test

EMI

ElectroMagnetic Interference

ESD

ElectroStatic Discharge

NWA

NetWork Analyzer

PCB

Printed-Circuit Board

PCS

Personal Communication System

RFI

Radio Frequency Interference

RoHS

Restriction of Hazardous Substances

SIM

Subscriber Identity Module

WLCSP

Wafer-Level Chip-Scale Package

Table 8.

Revision history

Document ID

Release date

Data sheet status Change notice Supersedes

IP4064CX8_IP4364CX8_

IP4366CX8_2

20100211

Product data sheet -

IP4064CX8LF_IP4364CX8LF_1

Modifications:

• Figure 3: added

IP4064CX8LF_IP4364CX8LF_1 20071112

Product data sheet -

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