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PCA9600DP Datasheet(PDF) 9 Page - NXP Semiconductors

Part # PCA9600DP
Description  Dual bidirectional bus buffer
PDF  30 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCA9600DP Datasheet(HTML) 9 Page - NXP Semiconductors

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PCA9600_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 11 November 2009
9 of 30
NXP Semiconductors
PCA9600
Dual bidirectional bus buffer
[1]
The maximum static sink current for a standard I2C-bus is 3 mA and PCA9600 is guaranteed to sink 3 mA at SX/SY when those pins are
holding the bus LOW. However, when an external device pulls the SX/SY pins below 1.4 V, the PCA9600 may source a current between
0 mA and 1 mA maximum. During contention an external device is required to pull the bus connected to SX or SY down to the 0.4 V
level referenced in the I2C-bus specification. So that device must be able to sink up to 1 mA from SX/SY plus the usual pull-up current.
Therefore the external pull-up used at SX/SY should be limited to 2 mA. The typical and maximum currents sourced by SX/SY as a
function of junction temperature are shown in Figure 10, and the equivalent circuit at the SX/SY interface is shown in Figure 4.
[2]
Valid over temperature for VCC ≤ 5 V. At higher VCC, this current may increase to maximum −20 µA at VCC =15V.
[3]
The input logic threshold is independent of the supply voltage.
[4]
The minimum value requirement for pull-up current, 0.3 mA, guarantees that the minimum value for VSX output LOW will always exceed
the maximum VSX input HIGH level to eliminate any possibility of latching. The specified difference is guaranteed by design within any
IC. While the tolerances on absolute levels allow a small probability, the LOW from one SX output is recognized by an SX input of
another PCA9600, this has no consequences for normal applications. In any design the SX pins of different ICs should never be linked
because the resulting system would be very susceptible to induced noise and would not support all I2C-bus operating modes.
[5]
The fall time of VTX from 5 V to 2.5 V in the test is approximately 10 ns.
The fall time of VSX from 5 V to 2.5 V in the test is approximately 20 ns.
The rise time of VTX from 0 V to 2.5 V in the test is approximately 15 ns.
The rise time of VSX from 0.7 V to 2.5 V in the test is approximately 25 ns.
Buffer response time[5]
VCC = 5 V; pin TX pull-up resistor = 160 Ω; pin SX pull-up resistor = 2.2 kΩ; no capacitive load
td
delay time
VSX to VTX, VSY to VTY; on
falling input between
VSX = input switching
threshold, and VTX output
falling to 50 % VCC
-50
-
ns
VSX to VTX, VSY to VTY; on
rising input between
VSX = input switching
threshold, and VTX output
reaching 50 % VCC
-60
-
ns
VRX to VSX, VRY to VSY; on
falling input between
VRX = input switching
threshold, and VSX output
falling to 50 % VCC
-
100
-
ns
VRX to VSX, VRY to VSY; on
rising input between
VRX = input switching
threshold, and VSX output
reaching 50 % VCC
-95
-
ns
Input capacitance
Ci
input capacitance
effective input capacitance of
any signal pin measured by
incremental bus rise times;
guaranteed by design, not
production tested
--10
pF
Table 6.
Characteristics …continued
Tamb = −40 °C to +85 °C unless otherwise specified; voltages are specified with respect to GND with VCC = 2.5 V to 15 V
unless otherwise specified. Typical values are measured at VCC = 5 V and Tamb =25 °C.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit



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