TXS0104EZXUR datasheet(2/24 Pages) TI

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YZT (WCSP) PACKAGE

(TOP VIEW)

3 2 1

DESCRIPTION/ORDERING INFORMATION

TXS0104E

SCES651D – JUNE 2006 – REVISED MAY 2008............................................................................................................................................................... www.ti.com

TERMINAL ASSIGNMENTS

(YZT Package)

GND

VCCA

VCCB

This 4-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to

track VCCA. VCCA accepts any supply voltage from 1.65 V to 3.6 V. VCCA must be less than or equal to VCCB. The

B port is designed to track VCCB. VCCB accepts any supply voltage from 2.3 V to 5.5 V. This allows for low-voltage

bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

The TXS0104E is designed so that the OE input circuit is supplied by VCCA.

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a

pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

ORDERING INFORMATION

PACKAGE(1)(2)

ORDERABLE PART NUMBER

TOP-SIDE MARKING(3)

NanoFree — WCSP

(DSBGA)

0.23-mm Large Bump – YZT

Reel of 3000

TXS0104EYZTR

2N7

(Pb-free) 0.625-mm max

height)

UFBGA – GXU

TXS0104EGXUR

Reel of 2500

YF04E

UFBGA – ZXU (Pb-free)

TXS0104EZXUR

TXS0104ERGYR

QFN – RGY

Reel of 1000

YF04E

–40

°C to 85°C

TXS0104ERGYRG4

TXS0104ED

Tube of 50

TXS0104EDG4

SOIC – D

TXS0104E

TXS0104EDR

Reel of 2500

TXS0104EDRG4

TXS0104EPWR

TSSOP – PW

Reel of 2000

YF04E

TXS0104EPWRG4

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

YZT: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

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