PACKAGE OPTION ADDENDUM

www.ti.com

4-Sep-2010

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins

Package Qty

Eco Plan

(2)

Lead/

Ball Finish

MSL Peak Temp

(3)

Samples

(Requires Login)

OPA209AID

PREVIEW

SOIC

D

8

75

TBD

Call TI

Call TI

Samples Not Available

OPA209AIDBVR

PREVIEW

SOT-23

DBV

5

3000

TBD

Call TI

Call TI

Samples Not Available

OPA209AIDBVT

PREVIEW

SOT-23

DBV

5

250

TBD

Call TI

Call TI

Samples Not Available

OPA209AIDGKR

PREVIEW

MSOP

DGK

8

2500

TBD

Call TI

Call TI

Samples Not Available

OPA209AIDGKT

PREVIEW

MSOP

DGK

8

250

TBD

Call TI

Call TI

Samples Not Available

OPA209AIDR

PREVIEW

SOIC

D

8

2500

TBD

Call TI

Call TI

Samples Not Available

OPA2209AID

ACTIVE

SOIC

D

8

75

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

Purchase Samples

OPA2209AIDGKR

PREVIEW

MSOP

DGK

8

2500

TBD

Call TI

Call TI

Samples Not Available

OPA2209AIDGKT

PREVIEW

MSOP

DGK

8

250

TBD

Call TI

Call TI

Samples Not Available

OPA2209AIDR

ACTIVE

SOIC

D

8

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

Request Free Samples

OPA4209AIPW

PREVIEW

TSSOP

PW

14

90

TBD

Call TI

Call TI

Samples Not Available

OPA4209AIPWR

PREVIEW

TSSOP

PW

14

2000

TBD

Call TI

Call TI

Samples Not Available

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)