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Datasheet

Package Mechanical Specifications

Package Mechanical

Specifications

The Celeron D processor is packaged in a Flip-Chip Pin Grid Array (FC-mPGA4) package that

interfaces with the motherboard via a mPGA478B socket. The package consists of a processor core

mounted on a substrate pin-carrier. An integrated heat spreader (IHS) is attached to the package

substrate and core and serves as the mating surface for processor component thermal solutions

(such as a heatsink). Figure 3-1 shows a sketch of the processor package components and how they

are assembled together. Refer to the mPGA479, mPGA478A, mPGA478B, mPGA478C, and

mPGA476 Socket Design Guidelines for complete details on the mPGA478B socket.

The package components shown in Figure 3-1 include the following:

• Integrated Heat Spreader (IHS)

• Thermal Interface Material (TIM)

• Processor core (die)

• Package substrate

• Capacitors

NOTE:

1. Socket and motherboard are included for reference and are not part of processor package.

3.1

Package Mechanical Drawing

The package mechanical drawings are shown in Figure 3-2 and Figure 3-3. The drawings include

dimensions necessary to design a thermal solution for the processor. These dimensions include:

• Package reference with tolerances (total height, length, width, etc.)

• IHS parallelism and tilt

• Pin dimensions

• Top-side and back-side component keep-out dimensions

• Reference datums

All drawing dimensions are in mm [in].

Figure 3-1. Processor Package Assembly Sketch

SOCKET

SUBSTRATE

IHS

CAPACITORS

CORE (DIE)

MOTHERBOARD

TIM

SOCKET

SUBSTRATE

IHS

CAPACITORS

CORE (DIE)

MOTHERBOARD

TIM

335 Datasheet(PDF) 31 Page - Intel Corporation

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