MPXV4006DP datasheet(5/22 Pages) FREESCALE

5 / 22 page

MPXV4006

Sensors

Freescale Semiconductor

Pressure

On-Chip Temperature Compensation and Calibration

The performance over temperature is achieved by

integrating the shear-stress strain gauge, temperature

compensation, calibration and signal conditioning circuitry

onto a single monolithic chip.

Figure 2 illustrates the Differential or Gauge configuration

in the basic chip carrier (Case 482). A gel die coat isolates the

die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the silicon

diaphragm.

The MPXV4006/MPVZ4006 series sensor operating

characteristics are based on use of dry air as pressure media.

Media, other than dry air, may have adverse effects on sensor

performance and long-term reliability. Internal reliability and

qualification test for dry air, and other media, are available

from the factory. Contact the factory for information regarding

media tolerance in your application.

Figure 3 shows the recommended decoupling circuit for

interfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

Figure 4 and Figure 5 shows the sensor output signal

relative to pressure input. Typical, minimum and maximum

output curves are shown for operation over a temperature

range of 10

°C to 60°C using the decoupling circuit shown in

Figure 3. The output will saturate outside of the specified

pressure range.

Figure 2. Cross Sectional Diagram SOP

(not to scale)

Figure 3. Recommended Power Supply Decoupling

and Output Filtering Recommendations

(For additional output filtering, please refer to

Application Note AN1646.)

Figure 4. Output versus Pressure Differential

at ±5.0% VFSS (without auto zero, Note 5 in

Operating Characteristics)

Figure 5. Output versus Pressure Differential

at ±2.46% VFSS (with auto zero, Note 5 in

Operating Characteristics)

Fluorosilicone

Gel Die Coat

Wire

Bond

Differential Sensing

Element

Thermoplastic

Case

Stainless

Steel Cap

Lead

Frame

Die Bond

Die

1.0 μF

IPS

470 pF

OUTPUT

+5 V

0.01 μFGND

Vout

Differential Pressure (kPa)

4.0

3.0

2.0

1.0

02.0

4.5

4.0

6.0

5.0

3.5

2.5

1.5

0.5

VS = 5.0 Vdc

TEMP = 10 to 60°C

Transfer Function (kPa):

Vout = VS*[(0.1533*P) + 0.053] ± 5.0% VFSS

Differential Pressure (kPa)

4.0

3.0

2.0

1.0

02.0

4.5

4.0

6.0

MAX

MIN

5.0

3.5

2.5

1.5

0.5

VS = 5.0 Vdc

TEMP = 10 to 60°C

TYPICAL

Transfer Function (kPa):

Vout = VS*[(0.1533*P) + 0.053] ± 2.46% VFSS

MAX

MIN

TYPICAL

MPXV4006DP Datasheet(PDF) 5 Page - Freescale Semiconductor, Inc

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