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MPXV4006DP Datasheet(PDF) 6 Page - Freescale Semiconductor, Inc

Part # MPXV4006DP
Description  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
PDF  22 Pages
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPXV4006DP Datasheet(HTML) 6 Page - Freescale Semiconductor, Inc

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MPXV4006
Sensors
6
Freescale Semiconductor
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing a gel die coat which
isolates the die from the environment. The pressure sensor is
designed to operate with positive differential pressure
applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
Figure 6. SOP Footprint (Case 482)
Table 3. Pressure (P1)/Vacuum (P2) Side Identification Table
Part Number
Case Type
Pressure (P1) Side Identifier
MPVZ4006GW6U
1735-01
Vertical Port Attached
MPVZ4006GW7U
1560-02
Vertical Port Attached
MPVZ4006G6U/T1
482-01
Stainless Steel Cap
MPVZ4006G7U
482B-03
Stainless Steel Cap
MPXV4006GC6U/T1
482A
Vertical Port Attached
MPXV4006GC7U
482C-03
Vertical Port Attached
MPXV4006GP
1369-01
Side with Port Attached
MPXV4006DP
1351-01
Side with Part Marking
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP
2.54
0.300
7.62
inch
mm



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