MPC8308 datasheet(88/90 Pages) FREESCALE

88 / 90 page

MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 2

Freescale Semiconductor

Document Revision History

25 Document Revision History

Table 63 provides a revision history for this hardware specification.

Table 63. Document Revision History

Revision

Date

Substantive Change(s)

Rev 2

02/2011

• Added NVDDJ to Note-7 in Table 1.

•In Table 2,

Added Note-2

Added NVDDJ to Note-3

Added “Extended Temperature range from -40 to 105

°C, in the last row of the table

Changed “characteristic name Junction temperature” to “Operating temperature range”

•In Table 4, Note-3, changed ambient temperature to junction temperature, TJ = 105° C

•In Table 18,

tDDKHCS changed from 3.15ns to 2.5ns

tDDKHMP and tDDKHME values updated

•In Figure 6, corrected tDDKHMP & tDDKHME waveform

•In Table 53,

Y23 Package Pin Number changed from NC to VDD signal group

TSEC2_CRS is muxed with GPIO[0], shown as TSEC2_CRS/ GPIO[0]

•In Table 58, note-1, core_clk maximum operating frequency 333 MHz replaced with 400 MHz

Rev 1

06/2010

• In Table 4, TA = 105 replaced with TJ = 105

•In Table 8, fSYS_CLK_IN (Max) = 66 replaced with 66.67 and tSYS_CLK_IN (Min) = 15.15 replaced

with 15

•In Table 53, TSEC1_TMR_RX_ESFD replaced with TSEC2_TMR_RX_ESFD

TSEC1_TMR_TX_ESFD replaced with TSEC2_TMR_TX_ESFD

TSEC0_TMR_RX_ESFD replaced with TSEC1_TMR_RX_ESFD

TSEC0_TMR_TX_ESFD replaced with TSEC1_TMR_TX_ESFD

•In Table 56, rows from 1000 to 1111 removed

•In Table 57, SPMF 5:1 Option 167 MHz added.

Rev 0

05/2010

Initial release

MPC8308 Datasheet(PDF) 88 Page - Freescale Semiconductor, Inc