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MIC22600 Datasheet(PDF) 17 Page - Micrel Semiconductor |
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MIC22600 Datasheet(HTML) 17 Page - Micrel Semiconductor |
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17 / 29 page ![]() Micrel, Inc. MIC22600 October 2009 17 M9999-102809-C • RθJA is a combination of junction to case thermal resistance (RθJC) and Case-to-Ambient thermal resistance (RθCA), since thermal resistance of the solder connection from the ePAD to the PCB is negligible; RθCA is the thermal resistance of the ground plane to ambient, so RθJA = RθJC + RθCA. • TAMB is the Operating Ambient temperature. Example: The Evaluation board has 2 copper planes contributing to an RθJA of approximately 25°C/W. The worst case RθJC of the MLF 4x4 is 14 oC/W. R θ JA = RθJC + RθCA R θ JA = 14 + 25 = 39 oC/W To calculate the junction temperature for a 50°C ambient: TJ = TAMB+PDISS . RθJA TJ = 50 + (1.5 x 39) TJ = 109°C This is below the maximum of 125°C. VIN VOUT @6A 3 3.5 4 4.5 5 1 1.47 1.50 1.52 1.54 1.56 1.2 1.45 1.47 1.49 1.51 1.54 1.8 1.46 1.45 1.45 1.47 1.48 2.5 1.61 1.53 1.49 1.47 1.47 3.3 – 1.70 1.62 1.56 1.53 Table 2. Power Dissipation (W) for 6A output |
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