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BGU7007 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BGU7007 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 19 page ![]() BGU7007 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 1 — 20 May 2011 3 of 19 NXP Semiconductors BGU7007 SiGe:C Low Noise Amplifier MMIC for GPS, GLONASS and Galileo 3. Ordering information 4. Marking 5. Limiting values [1] Tsp is the temperature at the soldering point of the emitter lead. [2] Due to internal ESD diode protection, the applied voltage should not exceed the specified maximum in order to avoid excess current. [3] The RF input and RF output are AC coupled through internal DC blocking capacitors. 6. Thermal characteristics Table 3. Ordering information Type number Package Name Description Version BGU7007 XSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 1 × 1.45 × 0.5 mm SOT886 Table 4. Marking codes Type number Marking code BGU7007 B6 Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCC supply voltage RF input AC coupled −0.5 3.1 V VENABLE voltage on pin ENABLE VCC ≥ 2.5 V −0.5 3.1 V VCC < 2.5 V [2] −0.5 VCC +0.6 V VRF_IN voltage on pin RF_IN DC VCC ≥ 3.0 V [3] −0.5 3.6 V VCC < 3.0 V [2][3] −0.5 VCC +0.6 V VRF_OUT voltage on pin RF_OUT DC VCC ≥ 1.8 V [3] −0.5 3.6 V VCC < 1.8 V [2][3] −0.5 VCC +1.8 V Pi input power - 0 dBm Ptot total power dissipation Tsp ≤ 130 °C [1] 55 mW Tstg storage temperature −65 150 °C Tj junction temperature - 150 °C Table 6. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-sp) thermal resistance from junction to solder point 225 K/W |
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