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PCF8593 Datasheet(PDF) 18 Page - NXP Semiconductors

Part # PCF8593
Description  Low power clock and calendar
PDF  35 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCF8593 Datasheet(HTML) 18 Page - NXP Semiconductors

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PCF8593
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 04 — 6 October 2010
18 of 35
NXP Semiconductors
PCF8593
Low power clock and calendar
9.
Limiting values
[1]
Pass level; Human Body Model (HBM), according to Ref. 5 “JESD22-A114”.
[2]
Pass level; Machine Model (MM), according to Ref. 6 “JESD22-A115”.
[3]
Pass level; latch-up testing according to Ref. 7 “JESD78” at maximum ambient temperature (Tamb(max)).
[4]
According to the NXP store and transport requirements (see Ref. 9 “NX3-00092”) the devices have to be
stored at a temperature of +8
°C to +45 °C and a humidity of 25 % to 75 %. For long term storage products
deviant conditions are described in that document.
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDD
supply voltage
−0.8
+0.7
V
IDD
supply current
-
50
mA
ISS
ground supply current
-
50
mA
VI
input voltage
−0.8
VDD + 0.8
V
II
input current
-
10
mA
IO
output current
-
10
mA
Ptot
total power dissipation
-
300
mW
Po
output power
-
50
mW
VESD
electrostatic discharge
voltage
HBM
[1]
-
±3000
V
MM
[2]
-
±300
V
Ilu
latch-up current
[3]
-
100
mA
Tstg
storage temperature
[4]
−65
+150
°C
Tamb
ambient temperature
operating device
−40
+85
°C



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