TJ2997GD datasheet(3/13 Pages) HTC

3 / 13 page

DDR Termination Regulator

TJ2997

Apr, 2011 - R1.0.1

3/13

HTC

ELECTRICAL CHARACTERISTICS (1)

Specifications with standard typeface are for TJ = 25˚. Unless otherwise specified, AVIN = 2.5V, PVIN = VDDQ = 1.8V

(1), (2), (3) for

DDRⅡ. AVIN = 2.5V, PVIN = VDDQ = 1.5V

(1), (2), (3) for DDRⅢ.

PARAMETER

SYMBOL

TEST CONDITION

MIN.

TYP.

MAX.

UNIT

VREF Voltage

VREF

VDDQ = 1.8V

0.882

0.90

0.918

VREF Voltage

VREF

VDDQ = 1.5V

0.735

0.75

0.765

VTT Output Voltage

VTT

IOUT = 0 A

VDDQ = 1.8V, PVIN = 1.8V

IOUT = ± 0.9 A

(6)

VDDQ = 1.8V, PVIN = 1.8V

0.86

0.90

0.94

VTT Output Voltage

VTT

IOUT = 0 A

@ VDDQ = 1.5V, PVIN = 1.5V

IOUT = ± 0.5 A

(6)

@ VDDQ = 1.5V, PVIN = 1.5V

IOUT = ± 0.9A

(6)

@ VDDQ = 1.5V, PVIN = 1.8V

0.71

0.75

0.79

VTT Output Voltage Offset

VOSVTT

IOUT = 0 A

IOUT = ± 0.5 A

(6)

IOUT = ± 0.9 A

(6) (if applicable)

-25

Quiescent Current

(4)

IOUT = 0A

250

500

VDDQ Input Impedance

ZVDDQ

100

kΩ

Quiescent Current in Shutdown

(4)

ISD

EN = 0V

150

300

Shutdown Leakage Current

IQ_SD

EN = 0V

0.1

0.5

Minimum Enable High Level

VIH

1.9

(7)

Maximum Enable Low Level

VIL

0.6

VTT Leakage Current in Shutdown

EN= 0V, VTT = 1.25V

VSENSE Input Current

ISENSE

0.1

Thermal Shutdown

(5)

TSD

165

℃

Note 1. Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating range indicates conditions

for which the device is intended to be functional, but does not guarantee specific performance limits. For guaranteed

specifications and test conditions see Electrical Characteristics. The guaranteed specifications apply only for the test conditions

listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.

Note 2. At elevated temperatures, devices must be derated based on thermal resistance. The device in the SOP8 package must be

derated at θJA = 165˚ C/W junction to ambient with no heat sink.

Note 3. Limits are 100% production tested at 25˚C. Limits over the operating temperature range are guaranteed through correlation.

Note 4. Quiescent current defined as the current flow into AVIN.

Note 5. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction to ambient

thermal resistance, θJA, and the ambient temperature, TA. Exceeding the maximum allowable power dissipation will cause

excessive die temperature and the regulator will go into thermal shutdown.

Note 6. VTT load regulation is tested by using a 10 ms current pulse and measuring VTT.

Note 7. In the case of AVIN > 2.5V, minimum enable high level is AVIN * 0.7.

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