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MPC8569E Datasheet(PDF) 122 Page - Freescale Semiconductor, Inc |
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MPC8569E Datasheet(HTML) 122 Page - Freescale Semiconductor, Inc |
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122 / 127 page ![]() MPC8569E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1 Package Parameters for the MPC8569E Freescale Semiconductor 122 4.1 Package Parameters for the MPC8569E The following table provides the package parameters for the FC-PBGA. The package type is 29 mm × 29 mm, 783 plastic ball grid array (FC-PBGA). Table 83. Package Parameters Parameter PBGA Package outline 29 mm × 29 mm Interconnects 783 Ball pitch 1 mm Ball diameter (typical) 0.6 mm Solder ball (lead-free) 96.5% Sn 3% Ag 0.5% Cu |
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