MPC8569E datasheet(123/127 Pages) FREESCALE

Part #	MPC8569E

Description	MPC8569E PowerQUICC III

PDF	127 Pages

Scroll/Zoom	100%

Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

Direct Link	http://www.freescale.com

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123 / 127 page

Mechanical Dimensions of the FC-PBGA with Full Lid

MPC8569E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1

Freescale Semiconductor

123

4.2

Mechanical Dimensions of the FC-PBGA with Full Lid

The following figure shows the mechanical dimensions and bottom surface nomenclature for the MPC8569E FC-PBGA

package with full lid.

Notes:

1All dimensions are in millimeters.

2Dimensions and tolerances per ASME Y14.5M-1994.

3Maximum solder ball diameter measured parallel to datum A.

4Datum A, the seating plane, is determined by the spherical crowns of the solder balls.

5Parallelism measurement shall exclude any effect of mark on top surface of package.

6All dimensions are symmetric across the package center lines unless dimensioned otherwise.

729.2 mm maximum package assembly (lid and laminate) x and y.

Figure 75. MPC8569E FC-PBGA Package with Full Lid

MPC8569E Datasheet(PDF) 123 Page - Freescale Semiconductor, Inc