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TMDS261BPAGR Datasheet(PDF) 12 Page - Texas Instruments |
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TMDS261BPAGR Datasheet(HTML) 12 Page - Texas Instruments |
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12 / 48 page ![]() TMDS261B SLLS987A – SEPTEMBER 2009 – REVISED JULY 2011 www.ti.com TMDS DDC and Local I 2C Pins DDC I2C Buffer or Repeater: The TMDS261B provides buffering on the DDC I2C interface for each of the input ports connected. This feature isolates the capacitance on the source side from the sink side and thus helps in passing system-level compliance. See the DDC I2C Function Description section for a detailed description on how the DDC I2C buffer operates. Note that a key requirement on the sink side is that the VIL(Sink) (input to TMDS261B) should be less than 0.4 V. This requirement should be met for the DDC I2C buffer to function properly. There are three settings of VIL(Sink) and VOL(Sink) that can be chosen based on OVS settings (See Table 8 through Table 11). Local I2C Interface: The TMDS261B includes a slave I2C interface to control device features like TMDS input port selection, TMDS output edge-rate control, power management, DDC buffer OVS settings, etc. See Table 8 through Table 11. The TMDS261B is designed to be controlled via a local I2C interface or GPIO interface, based on the status of the I2C_SEL pin. The local I2C interface in the TMDS261B is only a slave I2C interface. See the I2C INTERFACE NOTES section for a detailed description of I2C functionality. ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IL Low-level input current VCC = 3.6 V, VI = 0 V –10 10 μA Ilkg(Sink) Input leakage current Sink pins VCC = 3.6 V, VI = 4.95 V –10 10 μA CIO(Sink) Input/output capacitance Sink pins DC bias = 2.5 V, ac = 3.5 Vp-p, f = 100 kHz 15 pF VIH(Sink) High-level input voltage Sink pins 2.1 5.5 V VIL1(Sink) Low-level input voltage Sink pins OVS 1 –0.2 0.4 V VOL1(Sink) Low-level output voltage Sink pins IO = 3 mA, OVS = HIGH 0.6 0.7 V VIL2(Sink) Low-level input voltage Sink pins OVS 2 –0.2 0.4 V VOL2(Sink) Low-level output voltage Sink pins IO = 3 mA, OVS = LOW 0.5 0.6 V VIL3(Sink) Low-level input voltage Sink pins OVS 3 –0.2 0.3 V VOL3(Sink) Low-level output voltage Sink pins IO = 3 mA, OVS = high-Z 0.4 0.5 V Ilkg(I2C) Input leakage current Port[1:2] pins VCC = 3.6 V, VI = 4.95 V –10 10 μA CIO(I2C) Input/output capacitance Port[1:2] pins DC bias = 2.5 V, ac = 3.5 Vp-p, f = 100 kHz 15 pF VIH(I2C) High-level input voltage Port[1:2] pins 2.1 5.5 V VIL(I2C) Low-level input voltage Port[1:2] pins –0.2 1.5 V VOL(I2C) Low-level output voltage Port[1:2] pins IO = 3 mA 0.2 V 12 Copyright © 2009–2011, Texas Instruments Incorporated |
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