TLV4113MDGQREP datasheet(4/25 Pages) TI1

4 / 25 page

100

120

125

130

135

140

145

150

155

160

Continous TJ − 5C

DISSIPATION RATING TABLE

TLV4110-EP, TLV4111-EP

TLV4112-EP, TLV4113-EP

SGLS314D – JUNE 2006 – REVISED MAY 2008............................................................................................................................................................... www.ti.com

Figure 1. TLV4113MDGQ Wirebond Life

TA ≤ 25°C

TA = 25°C

PACKAGE

(

°C/W)

(

°C/W)

POWER RATING

D (8)

38.3

176

710 mW

142 mW

D (14)

26.9

122.3

1022 mW

204.4 mW

DGN (8)(1)

4.7

52.7

2.37 W

474.4 mW

DGQ (10)(1)

4.7

52.3

2.39 W

478 mW

(1)

See the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report (SLMA002), for more information on

the PowerPAD package. The thermal data was measured on a PCB layout, based on information in the section entitled Texas

Instruments Recommended Board for PowerPAD, on page 33 of SLMA002.

Submit Documentation Feedback

Product Folder Link(s): TLV4110-EP, TLV4111-EP TLV4112-EP, TLV4113-EP

TLV4113MDGQREP Datasheet(PDF) 4 Page - Texas Instruments

TLV4113MDGQREP Datasheet(HTML) 4 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

Datasheet Download

Link URL