1

FEATURES

1

2

3

4

8

7

6

5

1OUT

1IN −

1IN +

GND

2OUT

2IN −

2IN+

TLV4112

D OR DGN PACKAGE

(TOP VIEW)

P0029-01

DESCRIPTION

TLV4110-EP, TLV4111-EP

TLV4112-EP, TLV4113-EP

HIGH-OUTPUT-DRIVE OPERATIONAL AMPLIFIERS

WITH SHUTDOWN

23

• Controlled Baseline

–

One Assembly Site

–

One Test Site

–

One Fabrication Site

• Extended Temperature Performance of

–55

°C to 125°C

• Enhanced Diminishing Manufacturing Sources

(DMS) Support

• Enhanced Product-Change Notification

The TLV411x single-supply operational amplifiers

• High Output Drive . . . >300 mA

provide output currents in excess of 300 mA at 5 V.

This enables standard pin-out amplifiers to be used

• Rail-To-Rail Output

as high current buffers or in coil driver applications.

• Unity-Gain Bandwidth . . . 2.7 MHz

The TLV4110 and TLV4113 come with a shutdown

• Slew Rate . . . 1.5 V/µs

feature.

• Supply Current . . . 700 µA/Per Channel

The TLV411x is available in the ultra-small MSOP

• Supply Voltage Range . . . 2.5 V to 6 V

PowerPAD™ package, which offers the exceptional

thermal impedance required for amplifiers delivering

• Universal Op Amp EVM

high current levels.

(1)

Component qualification in accordance with JEDEC and

industry standards to ensure reliable operation over an

All TLV411x devices are offered in SOIC (single and

extended temperature range. This includes, but is not limited

dual) and MSOP PowerPAD (dual).

to, Highly Accelerated Stress Test (HAST) or biased 85/85,

temperature cycle, autoclave or unbiased HAST,

electromigration, bond intermetallic life, and mold compound

life. Such qualification testing should not be viewed as

justifying use of this component beyond specified

performance and environmental limits.

FAMILY PACKAGE TABLE

PACKAGE TYPES

NUMBER OF

DEVICE

SHUTDOWN

UNIVERSAL EVM BOARD

CHANNELS

MSOP

SOIC

TLV4110

1

8

8

Yes

TLV4111

1

8

8

–

See the EVM Selection Guide (SLOU060)

TLV4112

2

8

8

–

TLV4113

2

10

14

Yes

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2

PowerPAD is a trademark of Texas Instruments.

3

Parts, Microsim PSpice are trademarks of MicroSim Corporation.

PRODUCTION DATA information is current as of publication date.

Copyright © 2006–2008, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.