TPS22966DPUT datasheet(2/26 Pages) TI1

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TPS22966

SLVSBH4A – JUNE 2012 – REVISED JULY 2012

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

PACKAGE

ORDERABLE PART NO.

TOP-SIDE MARKING/STATUS

-40°C to 85°C

DPU

Tape and reel 3000 units

TPS22966DPUR

RB966

-40°C to 85°C

DPU

Tape and reel 250 units

TPS22966DPUT

RB966

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1) (2)

VALUE

UNIT(2)

VIN1,2

Input voltage range

–0.3 to 6

VOUT1,2

Output voltage range

–0.3 to 6

VON1,2

Input voltage range

–0.3 to 6

IMAX

Maximum continuous switch current

IPLS

Maximum pulsed switch current, pulse <300 µs, 2% duty cycle

Operating free-air temperature range(3)

–40 to 85

°C

Maximum junction temperature

125

°C

TSTG

Storage temperature range

–65 to 150

°C

TLEAD

Maximum lead temperature (10-s soldering time)

300

°C

Human-Body Model (HBM)

2000

Electrostatic discharge

ESD

protection

Charged-Device Model (CDM)

1000

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the

maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package

in the application (

θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max))

THERMAL INFORMATION

TPS22966

THERMAL METRIC(1)

UNITS

DPU (14 PINS)

θJA

Junction-to-ambient thermal resistance

52.3

θJCtop

Junction-to-case (top) thermal resistance

45.9

θJB

Junction-to-board thermal resistance

11.5

°C/W

ψJT

Junction-to-top characterization parameter

0.8

ψJB

Junction-to-board characterization parameter

11.4

θJCbot

Junction-to-case (bottom) thermal resistance

6.9

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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