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TPS22966DPUT Datasheet(PDF) 7 Page - Texas Instruments |
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TPS22966DPUT Datasheet(HTML) 7 Page - Texas Instruments |
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7 / 26 page ![]() Top View Bottom View 1 VIN1 VIN1 ON VBIAS VIN2 VIN2 1 ON2 VOUT2 VOUT1 CT GND 1 CT2 VOUT2 VOUT1 14 14 1 VOUT2 VOUT1 GND CT1 CT2 VOUT2 VOUT1 VIN1 VIN1 VBIAS VIN2 VIN2 ON1 ON2 TPS22966 www.ti.com SLVSBH4A – JUNE 2012 – REVISED JULY 2012 DPU PACKAGE PIN TABLE TPS22966 PIN NAME I/O DESCRIPTION DPU 1 VIN1 I Switch #1 input. Bypass this input with a ceramic capacitor to GND. Recommended voltage range for this pin for optimal RON performance is 0.8V to VBIAS. 2 VIN1 I Switch #1 input. Bypass this input with a ceramic capacitor to GND. Recommended voltage range for this pin for optimal RON performance is 0.8V to VBIAS. 3 ON1 I Active high switch #1 control input. Do not leave floating. 4 VBIAS I Bias voltage. Power supply to the device. Recommended voltage range for this pin is 2.5V to 5.5V. See Application Information section. 5 ON2 I Active high switch #2 control input. Do not leave floating. 6 VIN2 I Switch #2 input. Bypass this input with a ceramic capacitor to GND. Recommended voltage range for this pin for optimal RON performance is 0.8V to VBIAS. 7 VIN2 I Switch #2 input. Bypass this input with a ceramic capacitor to GND. Recommended voltage range for this pin for optimal RON performance is 0.8V to VBIAS. 8 VOUT2 O Switch #2 output. 9 VOUT2 O Switch #2 output. 10 CT2 O Switch #2 slew rate control. Can be left floating. 11 GND – Ground 12 CT1 O Switch #1 slew rate control. Can be left floating. 13 VOUT1 O Switch #2 output. 14 VOUT1 O Switch #2 output. 15 Thermal Pad O Thermal pad (exposed center pad) to alleviate thermal stress. Tie to GND. See Application Information for layout guidelines. Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Link(s): TPS22966 |
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