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CPL-WB-01D3 Datasheet(PDF) 7 Page - STMicroelectronics |
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CPL-WB-01D3 Datasheet(HTML) 7 Page - STMicroelectronics |
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7 / 10 page ![]() CPL-WB-01D3 Package information Doc ID 019036 Rev 3 7/10 3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 7. Package dimensions Figure 8. Footprint Figure 9. Marking 1.0 mm ± 45 µm 595 µm 625 µm UBM: ø 220 µm ±50 µm Copper pad diameter: 220 µm recommended Solder stencil opening: 220 µm recommended Solder mask opening: 300 µm minimum 260 µm maximum x y x w z w Dot, ST logo ECOPACK grade xx = marking z = manufacturing location yww = datecode (y = year ww = week) |
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