EMIF01-TV02F3

Package information

Doc ID 15320 Rev 3

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Package information

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 9.

Package dimensions

Figure 10.

Footprint

Figure 11.

Marking

0.89 mm ± 30 µm

255 µm ± 40

400 µm ± 40 µm

605 µm ± 55

220 µm recommended

220 µm recommended

260 µm maximum

Solder stencil opening :

Copper pad Diameter:

Solder mask opening:

300 µm minimum